Application
As the Alumina ceramic wafer polishing and sapphire lapping disks used in the semi-conductive, diamond polishing etc.
Process: All types of Polishing and lapping process, such as CMP chemical mechanical polishing, Mechanical Polishing, Precision Polishing.
Feature
High purity and chemical durability
High Mechanical Strength and Hardness
High Corrosion Resistance
High Voltage Resistance
High Temperature Resistant Up to 1700ºC
Extremely Abrasion Resistance Performance
Excellent Insulation Performance
All type of Size 180,360, 450, 600mm etc
| Product name |
99.7 high purity Alumina ceramic Polishing Lapping Discs |
| Material |
99.7% alumina |
| Normal Size |
D180, 360, 450, 600mm, customized size accepted. |
| Color |
Ivory |
| Application |
Wafer and Sapphire CMP process in semi-conductive industry |
| Min.Order |
1Pic |
Chemical / physical Information
|
|
Unit |
99.7 Alumina Ceramics |
| General Properties |
Al2O3 content |
wt% |
99.7-99.9 |
| Density |
gm/cc |
3.94-3.97 |
| Color |
- |
Ivory |
| Water absorption |
% |
0 |
| Mechanical Properties |
Flexural Strength(MOR) 20 ºC |
Mpa(psix10^3) |
440-550 |
| Elastic Modulus 20ºC |
GPa (psix10^6) |
375 |
| Vickers Hardness |
Gpa(kg/mm2) R45N |
>=17 |
| Bending Strength |
Gpa |
390 |
| Tensile Strength 25ºC |
MPa(psix10^3) |
248 |
| Fracture Toughness (K I c) |
Mpa* m^1/2 |
4-5 |
| Thermal Properities |
Thermal conductivity(20ºC) |
W/mk |
30 |
| Coefficient of Thermal expansion(25-1000ºC) |
1x 10^-6/ºC |
7.6 |
| Thermal Shock Resistance |
ºC |
200 |
| Maximum use temperature |
ºC |
1700 |
| Electrical Properities |
Dielectric Strength (1MHz) |
ac-kv/mm(ac v/mil) |
8.7 |
| Dielectric Constant(1 MHz) |
25ºC |
9.7 |
| Volume Resistivity |
ohm-cm (25ºC) |
>10^14 |
| ohm-cm (500ºC) |
2x10^12 |
| ohm-cm (1000ºC) |
2x10^7 |
Service
We accept custom orders.
If you want to know more product information, please feel free contact us and we'll afford you the most suitable product and best service!